SMD assembly down to 0201 & BGA.
SMD assembly near Munich – from prototype to series
SMD assembly is the heart of our production. We populate PCBs single- and double-sided, in rigid or rigid-flex technology – lead-free (RoHS compliant) or, on request, with leaded solder. The range extends from 0201 chips to QFPs with 50 × 50 mm edge length, plus BGA, FBGA and µBGA with a pitch down to 0.3 mm.
We create a dedicated solder profile for every assembly to keep thermal stress as low as possible. A vapour phase soldering system is also available for demanding high-mix assemblies.
Your benefits
Down to 0201 and fine pitch
Components down to 0201, BGA and fine pitch down to 0.3 mm – placed with process reliability.
Short set-up times
Prototypes and small series from batch size 1 – series production then runs on the same lines.
Reflow or vapour phase
Convection reflow or vapour phase soldering, depending on the assembly – with a dedicated solder profile.
Inspection at every step
2D paste inspection in the printer, SPI for print process validation on request and 3D AOI (PARMI) for every assembly.
Technical data
| Component range | 0201 to QFP 50 × 50 mm, BGA, FBGA, µBGA, TSOP, SOIC – pitch down to 0.3 mm |
|---|---|
| PCBs | single- and double-sided, rigid, rigid-flex, metal core (IMS) – max. 510 × 360 mm |
| Soldering technology | Convection reflow, vapour phase (Galden 235 °C), lead-free – leaded on request |
| Lines | 2 SMD lines: DEK Horizon 03i and GKG G-Titan paste printers, JUKI KE-3010AL, KE-3020VAL, KE-2050RL, KE-2060RL pick-and-place machines |
| Inspection | PARMI 3D AOI for all assemblies, SPI for print process validation on request |
| Data formats | Gerber RS-274X, ODB++, placement data (pick & place), bill of materials as Excel/CSV |
Inside SMD production
Frequently asked questions about SMD assembly
Chip components down to size 0201 as well as BGA, µBGA and fine-pitch components down to 0.3 mm pitch.
Yes, from batch size 1. Short set-up times make prototypes and small series economical; series production then runs on the same lines.
Yes. In addition to standard lead-free production, we assemble with leaded solder on request, for example for legacy products or exempt applications.
